Solder paste is used to assemble and rework surface mount (SMT/SMD) circuit boards. The solder is in the form of microscopic bubbles of tin/lead that is suspended in a creme based flux.
It may be applied with a paste stencil or simply by hand using a syringe or fine tip applicator. To complete the solder joint, the connection is heated with a soldering iron, SMT hot air wand, or reflow oven. For other interesting SMD soldering methods, try searching the net for "toaster oven SMD reflow."
The photo shows a USA penny next to the 50 gram jar.
Specifications:
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Convenient 50 gram Jar for small projects
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180°C / 350°F melting point (approximate)
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Very good wetting and flow characteristics
Note: Solder paste typically has a one year shelf life if it is kept at a cool temperature (do not store near food, 10°C/50°F is recommended). To promote the longest shelf life, keep the lid on tight whenever it is not actively being used.
